APA (7th ed.) Citation

Kyeong-Won Seol, J., Chang-Hee Choi, J., Sangyum Kim, J., Seong Ho Son, J., & Lee, J. K. (2003). On the mechanism of popcorn blistering in copper clad laminates. Journal of Adhesion Science & Technology, 17(10), 1331. https://doi.org/10.1163/156856103769172779

Chicago Style (17th ed.) Citation

Kyeong-Won Seol, J., J. Chang-Hee Choi, J. Sangyum Kim, J. Seong Ho Son, and Jong K. Lee. "On the Mechanism of Popcorn Blistering in Copper Clad Laminates." Journal of Adhesion Science & Technology 17, no. 10 (2003): 1331. https://doi.org/10.1163/156856103769172779.

MLA (9th ed.) Citation

Kyeong-Won Seol, J., et al. "On the Mechanism of Popcorn Blistering in Copper Clad Laminates." Journal of Adhesion Science & Technology, vol. 17, no. 10, 2003, p. 1331, https://doi.org/10.1163/156856103769172779.