Ultrashort Pulse Laser Cutting of Glass by Controlled Fracture Propagation.
Saved in:
| Title: | Ultrashort Pulse Laser Cutting of Glass by Controlled Fracture Propagation. |
|---|---|
| Authors: | Mishchik, Konstantin1 mishchik@celia.u-bordeaux1.fr, Leger, Clémentine Javaux2, Caulier, Ophélie Dematteo1, Skupin, Stefan1, Chimier, Benoit1, Hönninger, Clemens3, Kling, Rainer2, Duchateau, Guillaume1, Lopez, John1 |
| Source: | Journal of Laser Micro / Nanoengineering. 2016, Vol. 11 Issue 1, p66-70. 5p. |
| Subjects: | Lasers, Optical materials, Ultrashort laser pulses, Glass cutting, Numerical apertures, Household electronics, Medical equipment |
| Abstract: | We demonstrate that the use of low energy but high repetition ultrashort laser systems can be advantageous for glass laser cutting using method of controlled fracture propagation. In specific regime using low numerical aperture objective, elongated zone of energy deposition induces high mechanical stress allowing single-pass full cutting of 1mm-thick soda-lime glass. The crack can follow straight as well as curve trajectories with a radius down to 1 mm with a 1mm/s feedrate. In order to achieve high quality precise control on the fracture propagation we have studied the effects of experimental parameters such as numerical aperture, repetition rate, pulse energy, pulse duration, but also regimes of irradiations by single pulses or bursts. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Laser Micro / Nanoengineering is the property of Japan Laser Processing Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
Be the first to leave a comment!
