Thermal Safe Power (TSP): Efficient Power Budgeting for Heterogeneous Manycore Systems in Dark Silicon.
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| Title: | Thermal Safe Power (TSP): Efficient Power Budgeting for Heterogeneous Manycore Systems in Dark Silicon. |
|---|---|
| Authors: | Pagani, Santiago1, Khdr, Heba1, Chen, Jian-Jia2, Shafique, Muhammad1, Li, Minming3, Henkel, Jorg1 |
| Source: | IEEE Transactions on Computers. Jan2017, Vol. 66 Issue 1, p147-162. 16p. |
| Subjects: | Integrated circuits, Cooling systems, Thermal management (Electronic packaging), Power density, Energy consumption |
| Abstract: | Chip manufacturers provide the Thermal Design Power (TDP) for a specific chip. The cooling solution is designed to dissipate this power level. But because TDP is not necessarily the maximum power that can be applied, chips are operated with Dynamic Thermal Management (DTM) techniques. To avoid excessive triggers of DTM, usually, system designers also use TDP as power constraint. However, using a single and constant value as power constraint, e.g., TDP, can result in significant performance losses in homogeneous and heterogeneous manycore systems. Having better power budgeting techniques is a major step towards dealing with the dark silicon problem. This paper presents a new power budget concept, called Thermal Safe Power (TSP), which is an abstraction that provides safe power and power density constraints as a function of the number of simultaneously active cores. Executing cores at any power consumption below TSP ensures that DTM is not triggered. TSP can be computed offline for the worst cases, or online for a particular mapping of cores. TSP can also serve as a fundamental tool for guiding task partitioning and core mapping decisions, specially when core heterogeneity or timing guarantees are involved. Moreover, TSP results in dark silicon estimations which are less pessimistic than estimations using constant power budgets. [ABSTRACT FROM PUBLISHER] |
| Copyright of IEEE Transactions on Computers is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Items | – Name: Title Label: Title Group: Ti Data: Thermal Safe Power (TSP): Efficient Power Budgeting for Heterogeneous Manycore Systems in Dark Silicon. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Pagani%2C+Santiago%22">Pagani, Santiago</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Khdr%2C+Heba%22">Khdr, Heba</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Chen%2C+Jian-Jia%22">Chen, Jian-Jia</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Shafique%2C+Muhammad%22">Shafique, Muhammad</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Li%2C+Minming%22">Li, Minming</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AR" term="%22Henkel%2C+Jorg%22">Henkel, Jorg</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Computers%22">IEEE Transactions on Computers</searchLink>. Jan2017, Vol. 66 Issue 1, p147-162. 16p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Cooling+systems%22">Cooling systems</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+management+%28Electronic+packaging%29%22">Thermal management (Electronic packaging)</searchLink><br /><searchLink fieldCode="DE" term="%22Power+density%22">Power density</searchLink><br /><searchLink fieldCode="DE" term="%22Energy+consumption%22">Energy consumption</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Chip manufacturers provide the Thermal Design Power (TDP) for a specific chip. The cooling solution is designed to dissipate this power level. But because TDP is not necessarily the maximum power that can be applied, chips are operated with Dynamic Thermal Management (DTM) techniques. To avoid excessive triggers of DTM, usually, system designers also use TDP as power constraint. However, using a single and constant value as power constraint, e.g., TDP, can result in significant performance losses in homogeneous and heterogeneous manycore systems. Having better power budgeting techniques is a major step towards dealing with the dark silicon problem. This paper presents a new power budget concept, called Thermal Safe Power (TSP), which is an abstraction that provides safe power and power density constraints as a function of the number of simultaneously active cores. Executing cores at any power consumption below TSP ensures that DTM is not triggered. TSP can be computed offline for the worst cases, or online for a particular mapping of cores. TSP can also serve as a fundamental tool for guiding task partitioning and core mapping decisions, specially when core heterogeneity or timing guarantees are involved. Moreover, TSP results in dark silicon estimations which are less pessimistic than estimations using constant power budgets. [ABSTRACT FROM PUBLISHER] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of IEEE Transactions on Computers is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/TC.2016.2564969 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 16 StartPage: 147 Subjects: – SubjectFull: Integrated circuits Type: general – SubjectFull: Cooling systems Type: general – SubjectFull: Thermal management (Electronic packaging) Type: general – SubjectFull: Power density Type: general – SubjectFull: Energy consumption Type: general Titles: – TitleFull: Thermal Safe Power (TSP): Efficient Power Budgeting for Heterogeneous Manycore Systems in Dark Silicon. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Pagani, Santiago – PersonEntity: Name: NameFull: Khdr, Heba – PersonEntity: Name: NameFull: Chen, Jian-Jia – PersonEntity: Name: NameFull: Shafique, Muhammad – PersonEntity: Name: NameFull: Li, Minming – PersonEntity: Name: NameFull: Henkel, Jorg IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Text: Jan2017 Type: published Y: 2017 Identifiers: – Type: issn-print Value: 00189340 Numbering: – Type: volume Value: 66 – Type: issue Value: 1 Titles: – TitleFull: IEEE Transactions on Computers Type: main |
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