Silica-Embedded Silicon Nanophotonic On-Chip Networks.

Saved in:
Bibliographic Details
Title: Silica-Embedded Silicon Nanophotonic On-Chip Networks.
Authors: Kakoulli, Elena1, Soteriou, Vassos1, Koutsides, Charalambos1, Kalli, Kyriacos1
Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems. Jun2017, Vol. 36 Issue 6, p978-991. 14p.
Subjects: Nanophotonic integrated circuits, Multicore processors, Silicon compounds, Photonics, Optical waveguides
Abstract: On-chip nanophotonics offer high throughput, yet energy-efficient communication, traits that can prove critical to the continuance of multicore chip scalability. In this paper, we investigate and propose silicon nanophotonic components that are embedded entirely in the silica (SiO2) substrate, i.e., reside subsurface, as opposed to die on-surface silicon nanophotonics of prior-art. Among several offered advantages, such silicon-in-silica (SiS) nanophotonic structures empower the implementation of nonobstructive interconnect geometries that deliver an improved power-performance balance, as demonstrated experimentally. First, using exhaustive simulations based on commercial-grade optical software-based tools, we show that such SiS structures are feasible, and derive their geometry characteristics and design parameters. As a second step, utilizing SiS optical channels and filters, we then design two distinct SiS-based nanophotonic network-on-chip (PNoC) mesh-diagonal links topologies as a means of demonstrating our proof of concept. In further pushing the performance envelope, we next develop: 1) an associated contention-aware adaptive routing function and 2) a parallelized photonic channel allocation scheme, with both coupled to SiS-based PNoCs as elements, to respectively replace under-performing routing and flow-control photonic protocols currently utilized. An extensive experimental evaluation, including utilizing traffic benchmarks gathered from full-system chip multiprocessor simulations, shows that our methodology boosts network throughput by up to 59.7%, reduces communication latency by up to 78.7%, while improving the throughput-to-power ratio by up to 31.6% when compared to the state-of-the-art. [ABSTRACT FROM PUBLISHER]
Copyright of IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
Be the first to leave a comment!
You must be logged in first