View in EDS

Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations.

Saved in:
Bibliographic Details
Title: Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations.
Authors: Pin, S.1 samuel.pin@irt-saintexupery.com, Frémont, H.2, Guédon-Gracia, A.2
Source: Microelectronics Reliability. Sep2017, Vol. 76, p368-372. 5p.
Subjects: Reliability of electronics, Creep (Materials), Shear (Mechanics), Lead-free solder, Hazardous substances, Thermomechanical treatment, Computer simulation
Abstract: Reliability of electronics is mostly driven by the reliability of lead free solder alloys since the replacement of hazardous materials by RoHS directive. This study aims to combine experiments and finite elements modelling in order to get prepared for fatigue characterisation of complex soldering assemblies. It consists, at first, to identify creep coefficients from experiments and implement them into a numerical model. The model is used to discuss some discrepancies of the results and simulating thermal cycling tests. In a second step, the microstructure of aged specimens is correlated to numerical observations to help finding a proper failure scenario. [ABSTRACT FROM AUTHOR]
Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 125255464
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Pin%2C+S%2E%22">Pin, S.</searchLink><relatesTo>1</relatesTo><i> samuel.pin@irt-saintexupery.com</i><br /><searchLink fieldCode="AR" term="%22Frémont%2C+H%2E%22">Frémont, H.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Guédon-Gracia%2C+A%2E%22">Guédon-Gracia, A.</searchLink><relatesTo>2</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>. Sep2017, Vol. 76, p368-372. 5p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Reliability+of+electronics%22">Reliability of electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Creep+%28Materials%29%22">Creep (Materials)</searchLink><br /><searchLink fieldCode="DE" term="%22Shear+%28Mechanics%29%22">Shear (Mechanics)</searchLink><br /><searchLink fieldCode="DE" term="%22Lead-free+solder%22">Lead-free solder</searchLink><br /><searchLink fieldCode="DE" term="%22Hazardous+substances%22">Hazardous substances</searchLink><br /><searchLink fieldCode="DE" term="%22Thermomechanical+treatment%22">Thermomechanical treatment</searchLink><br /><searchLink fieldCode="DE" term="%22Computer+simulation%22">Computer simulation</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Reliability of electronics is mostly driven by the reliability of lead free solder alloys since the replacement of hazardous materials by RoHS directive. This study aims to combine experiments and finite elements modelling in order to get prepared for fatigue characterisation of complex soldering assemblies. It consists, at first, to identify creep coefficients from experiments and implement them into a numerical model. The model is used to discuss some discrepancies of the results and simulating thermal cycling tests. In a second step, the microstructure of aged specimens is correlated to numerical observations to help finding a proper failure scenario. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=125255464
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.microrel.2017.07.053
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 5
        StartPage: 368
    Subjects:
      – SubjectFull: Reliability of electronics
        Type: general
      – SubjectFull: Creep (Materials)
        Type: general
      – SubjectFull: Shear (Mechanics)
        Type: general
      – SubjectFull: Lead-free solder
        Type: general
      – SubjectFull: Hazardous substances
        Type: general
      – SubjectFull: Thermomechanical treatment
        Type: general
      – SubjectFull: Computer simulation
        Type: general
    Titles:
      – TitleFull: Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Pin, S.
      – PersonEntity:
          Name:
            NameFull: Frémont, H.
      – PersonEntity:
          Name:
            NameFull: Guédon-Gracia, A.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 09
              Text: Sep2017
              Type: published
              Y: 2017
          Identifiers:
            – Type: issn-print
              Value: 00262714
          Numbering:
            – Type: volume
              Value: 76
          Titles:
            – TitleFull: Microelectronics Reliability
              Type: main
ResultId 1