APA (7th ed.) Citation

Kim, S., Braun, T. M., Lee, H., Moffat, T. P., & Josell, D. (2022). Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias. Journal of The Electrochemical Society, 169(3), 1. https://doi.org/10.1149/1945-7111/ac5ad8

Chicago Style (17th ed.) Citation

Kim, S.-H, T. M. Braun, H.-J Lee, T. P. Moffat, and D. Josell. "Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias." Journal of The Electrochemical Society 169, no. 3 (2022): 1. https://doi.org/10.1149/1945-7111/ac5ad8.

MLA (9th ed.) Citation

Kim, S.-H, et al. "Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias." Journal of The Electrochemical Society, vol. 169, no. 3, 2022, p. 1, https://doi.org/10.1149/1945-7111/ac5ad8.