Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias.
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| Title: | Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias. |
|---|---|
| Authors: | Kim, S.-H.1, Braun, T. M.2, Lee, H.-J.1, Moffat, T. P.2, Josell, D.2 daniel.josell@nist.gov |
| Source: | Journal of The Electrochemical Society. Mar2022, Vol. 169 Issue 3, p1-15. 15p. |
| Subjects: | Microstructure, Convex geometry, Crystal texture, Copper, Motion capture (Human mechanics), Copper chlorides |
| Abstract: | The microstructure and crystallographic texture of copper electrodeposits in millimeter scale through silicon vias are characterized using electron backscatter diffraction. The deposits obtained from additive-containing CuSO4-H2SO4 electrolytes are characteristic of the superconformal deposition process, with growth textures and columnar grains consistent with previous findings in smaller TSV. The microstructure, like the filling evolution it records, changes substantially with chloride concentration for the concentrations of polymer suppressor used. With chloride concentrations of 80 µmol·l-1 and less, columnar grains of Cu capture the linear motion of the local growth front during filling with a strong <110> orientation along the elongated grain axes typical of deposition in chloride-containing Cu electrolytes. In the mid- and upper-via locations these columnar grains are angled upward from the sidewalls toward the center of the v-shaped growth front. In a limited region adjacent to the via bottom they extend vertically from the bottom surface. With millimolar chloride concentration, deposition also exhibits columnar grains with preferred <110> growth orientation in the lower region of the via and adjacent to the sidewalls. However, separation of the central deposit from the sidewalls results in a convex geometry of the growth front and spatially varying texture in most of the deposit. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of The Electrochemical Society is the property of IOP Publishing and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 156436614 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1149/1945-7111/ac5ad8 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 15 StartPage: 1 Subjects: – SubjectFull: Microstructure Type: general – SubjectFull: Convex geometry Type: general – SubjectFull: Crystal texture Type: general – SubjectFull: Copper Type: general – SubjectFull: Motion capture (Human mechanics) Type: general – SubjectFull: Copper chlorides Type: general Titles: – TitleFull: Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Kim, S.-H. – PersonEntity: Name: NameFull: Braun, T. M. – PersonEntity: Name: NameFull: Lee, H.-J. – PersonEntity: Name: NameFull: Moffat, T. P. – PersonEntity: Name: NameFull: Josell, D. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 03 Text: Mar2022 Type: published Y: 2022 Identifiers: – Type: issn-print Value: 00134651 Numbering: – Type: volume Value: 169 – Type: issue Value: 3 Titles: – TitleFull: Journal of The Electrochemical Society Type: main |
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