APA (7th ed.) Citation

Hsu, W., Yang, S., Lin, Y., Hsieh, W., Tu, K., Chiu, W., . . . Chen, C. (2023). Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO 2 Hybrid Joints. Nanomaterials (2079-4991), 13(17), 2448. https://doi.org/10.3390/nano13172448

Chicago Style (17th ed.) Citation

Hsu, Wei-You, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, and Chih Chen. "Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO 2 Hybrid Joints." Nanomaterials (2079-4991) 13, no. 17 (2023): 2448. https://doi.org/10.3390/nano13172448.

MLA (9th ed.) Citation

Hsu, Wei-You, et al. "Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO 2 Hybrid Joints." Nanomaterials (2079-4991), vol. 13, no. 17, 2023, p. 2448, https://doi.org/10.3390/nano13172448.