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Point of Contact.

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Bibliographic Details
Title: Point of Contact.
Authors: Bogatin, Eric1, Gallotello, Peter2, Barlag, Todd3, Just, Cory3
Source: Appliance Design. Sep2005, Vol. 53 Issue 9, p68-70. 3p. 4 Color Photographs, 1 Graph.
Subjects: Electronic probes, Electronic appliance testing, Product design, Electromechanical devices, Electronics
Abstract: Provides information on an interconnect technology based upon spring probes, which is being used by designers of portable electronic products. Benefits of the technology to design engineers; Telescopic electromechanical interconnects, which consist of one or more contact members and a helical coil spring; Capability of the technology to preserve the maximum battery life for the portable application.
Database: Engineering Source
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Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 18310735
AccessLevel: 6
PubType: Periodical
PubTypeId: serialPeriodical
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Point of Contact.
– Name: Author
  Label: Authors
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  Data: <searchLink fieldCode="AR" term="%22Bogatin%2C+Eric%22">Bogatin, Eric</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Gallotello%2C+Peter%22">Gallotello, Peter</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Barlag%2C+Todd%22">Barlag, Todd</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AR" term="%22Just%2C+Cory%22">Just, Cory</searchLink><relatesTo>3</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Appliance+Design%22">Appliance Design</searchLink>. Sep2005, Vol. 53 Issue 9, p68-70. 3p. 4 Color Photographs, 1 Graph.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Electronic+probes%22">Electronic probes</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+appliance+testing%22">Electronic appliance testing</searchLink><br /><searchLink fieldCode="DE" term="%22Product+design%22">Product design</searchLink><br /><searchLink fieldCode="DE" term="%22Electromechanical+devices%22">Electromechanical devices</searchLink><br /><searchLink fieldCode="DE" term="%22Electronics%22">Electronics</searchLink>
– Name: Abstract
  Label: Abstract
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  Data: Provides information on an interconnect technology based upon spring probes, which is being used by designers of portable electronic products. Benefits of the technology to design engineers; Telescopic electromechanical interconnects, which consist of one or more contact members and a helical coil spring; Capability of the technology to preserve the maximum battery life for the portable application.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=18310735
RecordInfo BibRecord:
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      – Code: eng
        Text: English
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        PageCount: 3
        StartPage: 68
    Subjects:
      – SubjectFull: Electronic probes
        Type: general
      – SubjectFull: Electronic appliance testing
        Type: general
      – SubjectFull: Product design
        Type: general
      – SubjectFull: Electromechanical devices
        Type: general
      – SubjectFull: Electronics
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      – TitleFull: Point of Contact.
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          Name:
            NameFull: Bogatin, Eric
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            NameFull: Gallotello, Peter
      – PersonEntity:
          Name:
            NameFull: Barlag, Todd
      – PersonEntity:
          Name:
            NameFull: Just, Cory
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          Dates:
            – D: 01
              M: 09
              Text: Sep2005
              Type: published
              Y: 2005
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            – TitleFull: Appliance Design
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