APA (7th ed.) Citation

XU, P., HUANG, H., ZOU, F., & SHAN, C. (2025). A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS. Thermal Science, 29(2B), 873. https://doi.org/10.2298/TSCI240610202X

Chicago Style (17th ed.) Citation

XU, Peng, Huan HUANG, Fa ZOU, and Chun SHAN. "A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS." Thermal Science 29, no. 2B (2025): 873. https://doi.org/10.2298/TSCI240610202X.

MLA (9th ed.) Citation

XU, Peng, et al. "A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS." Thermal Science, vol. 29, no. 2B, 2025, p. 873, https://doi.org/10.2298/TSCI240610202X.