A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS.
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| Title: | A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS. |
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| Authors: | Peng XU1, Huan HUANG1, Fa ZOU2, Chun SHAN1,3 shanchungpnu@126.com |
| Source: | Thermal Science. 2025, Vol. 29 Issue 2B, p873-887. 15p. |
| Subjects: | Three-dimensional integrated circuits, Heat transfer, Filler materials, Steady-state responses, Copper |
| Abstract: | This paper proposed a new heat dissipation structure with embedded both through silicon vias (TSV) and micro-channels to solve the complex heat problems of 3-D integrated circuits (3-D-IC). The COMSOL simulation model is established to investigate the characteristIC of steady-state response for the defined four cases. The simulation results show that our proposed heat dissipation structure (i.e., Case 4: 3-D-IC with embedded both TSV and micro-channels) can reduce steady-state temperature over 43.546%, 18.440%, and 12.338% in comparison Case 1 (i.e., 3-D-IC without embedded heat dissipation structure), Case 2 (i.e., 3-D-IC with only inserted TSV), and Case 3 (i.e., 3-D-IC with only embedded micro-channels), respectively. Besides, it is demonstrated that CNT as filler material of TSV and CNT nanofluid as coolant of micro-channels (i.e., the proposed Scheme 4) can further reduce steady-state temperature of 3D-IC with embedded our proposed heat dissipation structure. The corresponding results illustrated that the steady-state temperature of Scheme 4 is reduced by 13.767% as compared with Scheme 1 (i.e., the conventional Cu as filler material of TSV and water as coolant of micro-channels). Moreover, it is manifested that the heat transfer performance of 3-D-IC with embedded the proposed heat dissipation structure can be enhanced by the increase of TSV radius and flow rate of coolant of micro-channels. Therefore, our proposed heat dissipation structure has great prospect for enhancing heat transfer performance of 3-D-IC. [ABSTRACT FROM AUTHOR] |
| Copyright of Thermal Science is the property of Society of Thermal Engineers of Serbia and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 185703784 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Peng+XU%22">Peng XU</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Huan+HUANG%22">Huan HUANG</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Fa+ZOU%22">Fa ZOU</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Chun+SHAN%22">Chun SHAN</searchLink><relatesTo>1,3</relatesTo><i> shanchungpnu@126.com</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Thermal+Science%22">Thermal Science</searchLink>. 2025, Vol. 29 Issue 2B, p873-887. 15p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Three-dimensional+integrated+circuits%22">Three-dimensional integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+transfer%22">Heat transfer</searchLink><br /><searchLink fieldCode="DE" term="%22Filler+materials%22">Filler materials</searchLink><br /><searchLink fieldCode="DE" term="%22Steady-state+responses%22">Steady-state responses</searchLink><br /><searchLink fieldCode="DE" term="%22Copper%22">Copper</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: This paper proposed a new heat dissipation structure with embedded both through silicon vias (TSV) and micro-channels to solve the complex heat problems of 3-D integrated circuits (3-D-IC). The COMSOL simulation model is established to investigate the characteristIC of steady-state response for the defined four cases. The simulation results show that our proposed heat dissipation structure (i.e., Case 4: 3-D-IC with embedded both TSV and micro-channels) can reduce steady-state temperature over 43.546%, 18.440%, and 12.338% in comparison Case 1 (i.e., 3-D-IC without embedded heat dissipation structure), Case 2 (i.e., 3-D-IC with only inserted TSV), and Case 3 (i.e., 3-D-IC with only embedded micro-channels), respectively. Besides, it is demonstrated that CNT as filler material of TSV and CNT nanofluid as coolant of micro-channels (i.e., the proposed Scheme 4) can further reduce steady-state temperature of 3D-IC with embedded our proposed heat dissipation structure. The corresponding results illustrated that the steady-state temperature of Scheme 4 is reduced by 13.767% as compared with Scheme 1 (i.e., the conventional Cu as filler material of TSV and water as coolant of micro-channels). Moreover, it is manifested that the heat transfer performance of 3-D-IC with embedded the proposed heat dissipation structure can be enhanced by the increase of TSV radius and flow rate of coolant of micro-channels. Therefore, our proposed heat dissipation structure has great prospect for enhancing heat transfer performance of 3-D-IC. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Thermal Science is the property of Society of Thermal Engineers of Serbia and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.2298/TSCI240610202X Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 15 StartPage: 873 Subjects: – SubjectFull: Three-dimensional integrated circuits Type: general – SubjectFull: Heat transfer Type: general – SubjectFull: Filler materials Type: general – SubjectFull: Steady-state responses Type: general – SubjectFull: Copper Type: general Titles: – TitleFull: A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Peng XU – PersonEntity: Name: NameFull: Huan HUANG – PersonEntity: Name: NameFull: Fa ZOU – PersonEntity: Name: NameFull: Chun SHAN IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 03 Text: 2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 03549836 Numbering: – Type: volume Value: 29 – Type: issue Value: 2B Titles: – TitleFull: Thermal Science Type: main |
| ResultId | 1 |
