A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS.
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| Title: | A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS. |
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| Authors: | Peng XU1, Huan HUANG1, Fa ZOU2, Chun SHAN1,3 shanchungpnu@126.com |
| Source: | Thermal Science. 2025, Vol. 29 Issue 2B, p873-887. 15p. |
| Subjects: | Three-dimensional integrated circuits, Heat transfer, Filler materials, Steady-state responses, Copper |
| Abstract: | This paper proposed a new heat dissipation structure with embedded both through silicon vias (TSV) and micro-channels to solve the complex heat problems of 3-D integrated circuits (3-D-IC). The COMSOL simulation model is established to investigate the characteristIC of steady-state response for the defined four cases. The simulation results show that our proposed heat dissipation structure (i.e., Case 4: 3-D-IC with embedded both TSV and micro-channels) can reduce steady-state temperature over 43.546%, 18.440%, and 12.338% in comparison Case 1 (i.e., 3-D-IC without embedded heat dissipation structure), Case 2 (i.e., 3-D-IC with only inserted TSV), and Case 3 (i.e., 3-D-IC with only embedded micro-channels), respectively. Besides, it is demonstrated that CNT as filler material of TSV and CNT nanofluid as coolant of micro-channels (i.e., the proposed Scheme 4) can further reduce steady-state temperature of 3D-IC with embedded our proposed heat dissipation structure. The corresponding results illustrated that the steady-state temperature of Scheme 4 is reduced by 13.767% as compared with Scheme 1 (i.e., the conventional Cu as filler material of TSV and water as coolant of micro-channels). Moreover, it is manifested that the heat transfer performance of 3-D-IC with embedded the proposed heat dissipation structure can be enhanced by the increase of TSV radius and flow rate of coolant of micro-channels. Therefore, our proposed heat dissipation structure has great prospect for enhancing heat transfer performance of 3-D-IC. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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