APA (7th ed.) Citation

Wang, F., Gao, H., Xiao, Z., & Chen, Y. (2025). Analysis of micromorphological evolution of lead-free solder joints under random vibration. Soldering & Surface Mount Technology, 37(5), 377. https://doi.org/10.1108/SSMT-02-2025-0009

Chicago Style (17th ed.) Citation

Wang, Fusheng, Hongying Gao, Zewen Xiao, and Yajun Chen. "Analysis of Micromorphological Evolution of Lead-free Solder Joints Under Random Vibration." Soldering & Surface Mount Technology 37, no. 5 (2025): 377. https://doi.org/10.1108/SSMT-02-2025-0009.

MLA (9th ed.) Citation

Wang, Fusheng, et al. "Analysis of Micromorphological Evolution of Lead-free Solder Joints Under Random Vibration." Soldering & Surface Mount Technology, vol. 37, no. 5, 2025, p. 377, https://doi.org/10.1108/SSMT-02-2025-0009.