Binary and ternary copper(II) complexes with dipicolinic acid and selected bidentate ligands: a potentiometric study.
Saved in:
| Title: | Binary and ternary copper(II) complexes with dipicolinic acid and selected bidentate ligands: a potentiometric study. |
|---|---|
| Authors: | González, Antonio1 (AUTHOR), Sánchez, Nairim1 (AUTHOR), Araujo, Mary Lorena1 (AUTHOR), Hernández, Lino2 (AUTHOR), Lubes, Vito2 (AUTHOR) lubesv@usb.ve |
| Source: | Physics & Chemistry of Liquids. Apr2026, Vol. 64 Issue 2, p317-327. 11p. |
| Subjects: | Coordination compounds, Potentiometry, Copper compounds, Ligands (Chemistry), Species distribution, Picolinic acid |
| Abstract: | In this work, we present a study on the formation of binary and ternary complexes in the Cu(II)-Dipic-bidentate ligand systems using potentiometric measurements. The bidentate ligands were malonic acid (H2Mal, H2L), phthalic acid (H2Phtha, H2L), and salicylic acid (H2Sal, H2L); the primary ligand was dipicolinic acid (H2Dipic, H2L). The ionic medium used was 1.0 mol dm−3 KNO3 at 25°C and the potentiometric data were analysed with the LETAGROP program. In the binary Cu(II)-Mal system, the complexes Cu(HL)+, CuL, Cu(OH)L−, and Cu(L)22− were detected and, for the Cu(II)-Phtha system the species Cu(HL)+, CuL, Cu(OH)L− were observed. In the ternary Cu(II)-Dipic-Mal and Cu(II)-Dipic-Phtha systems, the LETAGROP analysis showed the formation of the ternary complexes Cu(Dipic)(HL)−, Cu(Dipic)(L)2- and Cu(OH)(Dipic)(L)3-. Finally, in the Cu(II)-Dipic-Sal system, a unique species Cu(Dipic)(HL)− was detected. The species distribution diagrams are briefly discussed. [ABSTRACT FROM AUTHOR] |
| Copyright of Physics & Chemistry of Liquids is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
Be the first to leave a comment!
