Li, Z., Han, Z., Zhang, X., Xu, Y., Zou, L., Huang, K., & Ren, H. (2026). Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials. Polymers (20734360), 18(10), 1232. https://doi.org/10.3390/polym18101232
Chicago Style (17th ed.) CitationLi, Zhen, Zhiyun Han, Xinkai Zhang, Yizhou Xu, Liang Zou, Kejie Huang, and Hanwen Ren. "Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials." Polymers (20734360) 18, no. 10 (2026): 1232. https://doi.org/10.3390/polym18101232.
MLA (9th ed.) CitationLi, Zhen, et al. "Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials." Polymers (20734360), vol. 18, no. 10, 2026, p. 1232, https://doi.org/10.3390/polym18101232.