APA (7th ed.) Citation

Kohler, F., Germond, L., Wagnière, J., & Rappaz, M. (2009). Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed. Acta Materialia, 57(1), 56. https://doi.org/10.1016/j.actamat.2008.08.058

Chicago Style (17th ed.) Citation

Kohler, F., L. Germond, J.-D Wagnière, and M. Rappaz. "Peritectic Solidification of Cu–Sn Alloys: Microstructural Competition at Low Speed." Acta Materialia 57, no. 1 (2009): 56. https://doi.org/10.1016/j.actamat.2008.08.058.

MLA (9th ed.) Citation

Kohler, F., et al. "Peritectic Solidification of Cu–Sn Alloys: Microstructural Competition at Low Speed." Acta Materialia, vol. 57, no. 1, 2009, p. 56, https://doi.org/10.1016/j.actamat.2008.08.058.