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Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed

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Title: Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed
Authors: Kohler, F.1 frederic.kohler@a3.epfl.ch, Germond, L.1, Wagnière, J.-D.1, Rappaz, M.1 michel.rappaz@epfl.ch
Source: Acta Materialia. Jan2009, Vol. 57 Issue 1, p56-68. 13p.
Subjects: Copper-tin alloys, Solidification, Microstructure, Nucleation, Electron backscattering, Chemical reactions
Abstract: Abstract: Directional solidification experiments on Cu–Sn peritectic alloys have been conducted at very low velocity in a high-thermal-gradient Bridgman furnace. The size of the samples has been reduced in order to decrease natural convection and the associated macrosegregation. At the lowest growth rates (0.5 and 0.58μms−1), eutectic-like α+β lamellar structures have been observed in near-peritectic composition alloys over several millimeters of growth. These structures resulted from a destabilization of a band structure in which α- and β-phases overlay each other. Electron backscattered diffraction measurements revealed that bands and lamellae of a solid phase are continuous and originate from a single nucleus. [Copyright &y& Elsevier]
Copyright of Acta Materialia is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 35330232
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  Data: <searchLink fieldCode="DE" term="%22Copper-tin+alloys%22">Copper-tin alloys</searchLink><br /><searchLink fieldCode="DE" term="%22Solidification%22">Solidification</searchLink><br /><searchLink fieldCode="DE" term="%22Microstructure%22">Microstructure</searchLink><br /><searchLink fieldCode="DE" term="%22Nucleation%22">Nucleation</searchLink><br /><searchLink fieldCode="DE" term="%22Electron+backscattering%22">Electron backscattering</searchLink><br /><searchLink fieldCode="DE" term="%22Chemical+reactions%22">Chemical reactions</searchLink>
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  Data: Abstract: Directional solidification experiments on Cu–Sn peritectic alloys have been conducted at very low velocity in a high-thermal-gradient Bridgman furnace. The size of the samples has been reduced in order to decrease natural convection and the associated macrosegregation. At the lowest growth rates (0.5 and 0.58μms−1), eutectic-like α+β lamellar structures have been observed in near-peritectic composition alloys over several millimeters of growth. These structures resulted from a destabilization of a band structure in which α- and β-phases overlay each other. Electron backscattered diffraction measurements revealed that bands and lamellae of a solid phase are continuous and originate from a single nucleus. [Copyright &y& Elsevier]
– Name: AbstractSuppliedCopyright
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  Group: Ab
  Data: <i>Copyright of Acta Materialia is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1016/j.actamat.2008.08.058
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        Text: English
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      – SubjectFull: Solidification
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      – SubjectFull: Microstructure
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      – SubjectFull: Nucleation
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              Text: Jan2009
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