Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed
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| Title: | Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed |
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| Authors: | Kohler, F.1 frederic.kohler@a3.epfl.ch, Germond, L.1, Wagnière, J.-D.1, Rappaz, M.1 michel.rappaz@epfl.ch |
| Source: | Acta Materialia. Jan2009, Vol. 57 Issue 1, p56-68. 13p. |
| Subjects: | Copper-tin alloys, Solidification, Microstructure, Nucleation, Electron backscattering, Chemical reactions |
| Abstract: | Abstract: Directional solidification experiments on Cu–Sn peritectic alloys have been conducted at very low velocity in a high-thermal-gradient Bridgman furnace. The size of the samples has been reduced in order to decrease natural convection and the associated macrosegregation. At the lowest growth rates (0.5 and 0.58μms−1), eutectic-like α+β lamellar structures have been observed in near-peritectic composition alloys over several millimeters of growth. These structures resulted from a destabilization of a band structure in which α- and β-phases overlay each other. Electron backscattered diffraction measurements revealed that bands and lamellae of a solid phase are continuous and originate from a single nucleus. [Copyright &y& Elsevier] |
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| Database: | Engineering Source |
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