Enhanced properties of nano-grained pure copper by equal channel angular rolling and post-annealing
Saved in:
| Title: | Enhanced properties of nano-grained pure copper by equal channel angular rolling and post-annealing |
|---|---|
| Authors: | Habibi, Asiyeh a_habibi@aut.ac.ir, Ketabchi, Mostafa1 |
| Source: | Materials & Design. Feb2012, Vol. 34, p483-487. 5p. |
| Subjects: | Rolling (Metalwork), Copper, Material plasticity, Deformations (Mechanics), Microhardness, Annealing of metals, Temperature effect |
| Abstract: | Abstract: The pure copper sample was severely plastically deformed by 8-pass equal channel angular rolling process. The thermal stability of processed copper was investigated by measuring the development of microhardness at isochronal annealing temperature. According to variation in microhardness, the recrystallization temperature of pure copper after 8 pass of equal channel angular rolling process was 230°C. The influence of post-annealing on microstructure, mechanical and electrical properties of the 8-pass processed copper was investigated. Scanning electron microscopy micrographs and X-ray diffraction peak broadening analysis have demonstrated that grain size decreased with post-annealing, which is the reason for the increase in strength of the copper specimen. The electrical conductivity of sample increased after post-annealing because of the rearrangement of dislocations. [Copyright &y& Elsevier] |
| Copyright of Materials & Design is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
Be the first to leave a comment!