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Differential Via Modeling Methodology.

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Bibliographic Details
Title: Differential Via Modeling Methodology.
Authors: Simonovich, Lambert1, Bogatin, Eric2, Cao, Yazi3
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology. May2011, Vol. 1 Issue 5, p722-730. 9p.
Subjects: Integrated circuits, Electric impedance, Electric capacity, Electric displacement, Permittivity, Mathematical models, Radio frequency, Simulation methods & models, Printed circuits
Abstract: This paper describes a novel method of modeling the differential via on multilayered printed circuit boards (PCBs) used in high-speed digital designs based on the analytical equations for characteristic impedance and effective dielectric constant. In the absence of measured or electromagnetic simulated data traditionally needed to extract these parameters, this method can quickly and efficiently predict the behavior of the differential via holes on PCBs using a circuit simulator. [ABSTRACT FROM PUBLISHER]
Copyright of IEEE Transactions on Components, Packaging & Manufacturing Technology is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 69665619
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: <searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+impedance%22">Electric impedance</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+capacity%22">Electric capacity</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+displacement%22">Electric displacement</searchLink><br /><searchLink fieldCode="DE" term="%22Permittivity%22">Permittivity</searchLink><br /><searchLink fieldCode="DE" term="%22Mathematical+models%22">Mathematical models</searchLink><br /><searchLink fieldCode="DE" term="%22Radio+frequency%22">Radio frequency</searchLink><br /><searchLink fieldCode="DE" term="%22Simulation+methods+%26+models%22">Simulation methods & models</searchLink><br /><searchLink fieldCode="DE" term="%22Printed+circuits%22">Printed circuits</searchLink>
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  Data: This paper describes a novel method of modeling the differential via on multilayered printed circuit boards (PCBs) used in high-speed digital designs based on the analytical equations for characteristic impedance and effective dielectric constant. In the absence of measured or electromagnetic simulated data traditionally needed to extract these parameters, this method can quickly and efficiently predict the behavior of the differential via holes on PCBs using a circuit simulator. [ABSTRACT FROM PUBLISHER]
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  Data: <i>Copyright of IEEE Transactions on Components, Packaging & Manufacturing Technology is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
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      – Type: doi
        Value: 10.1109/TCPMT.2010.2103313
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      – Code: eng
        Text: English
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        PageCount: 9
        StartPage: 722
    Subjects:
      – SubjectFull: Integrated circuits
        Type: general
      – SubjectFull: Electric impedance
        Type: general
      – SubjectFull: Electric capacity
        Type: general
      – SubjectFull: Electric displacement
        Type: general
      – SubjectFull: Permittivity
        Type: general
      – SubjectFull: Mathematical models
        Type: general
      – SubjectFull: Radio frequency
        Type: general
      – SubjectFull: Simulation methods & models
        Type: general
      – SubjectFull: Printed circuits
        Type: general
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      – TitleFull: Differential Via Modeling Methodology.
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            NameFull: Simonovich, Lambert
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            NameFull: Bogatin, Eric
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            NameFull: Cao, Yazi
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              M: 05
              Text: May2011
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              Y: 2011
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