View in EDS

A Comparison Study of Friction Measurements for Chip Seal.

Saved in:
Bibliographic Details
Title: A Comparison Study of Friction Measurements for Chip Seal.
Authors: Lee, Jusang1 jlee@indot.in.gov, Lee, Jaejun2 yijaejun@kict.re.kr, Kim, Y. Richard3 kim@ncsu.edu, Mun, Sungho4 smun@seoultech.ac.kr
Source: Journal of Testing & Evaluation. Jul2012, Vol. 40 Issue 4, p603-611. 9p.
Subjects: Microprocessor testing, Pendulums, Pavements, Material fatigue
Geographic Terms: North America
Abstract: This paper presents a development in measuring skid resistance in a laboratory performance test for chip seal. It is important to develop a relationship between the British pendulum test (BPT) and the locked-wheel skid test (LWST), or grip tester (GT). The chip seal is a typical pavement preservation treatment used by the North Carolina Dept. of Transportation (NCDOT). In North America, loss of skid resistance is a common road condition that indicates the need for a chip seal, as one of the major advantages of chip seal is an increase in skid resistance. Most agencies have a specified cycle in which skid resistance is measured as a part of their pavement-management system. These skid resistance measurements are invaluable when deciding which roads require chip seal [Gransberg, D. D. and James, D. M. B., "Chip Seal Best Practices," NCHRP Synthesis of Highway Practice 342, Transportation Research Board of the National Academies, Washington, D.C., 2005]. In this study, skid resistance was evaluated on 14 selected chip seals using three different tests: the BPT, LWST, and GT. The correlation between British pendulum number (BPN) and skid number (SN) was relatively strong with an R2 value of 0.74. This finding indicated that the BPN measured in the laboratory could be utilized for predicting the SN, which cannot be measured in the laboratory. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Testing & Evaluation is the property of ASTM International and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 78947935
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: A Comparison Study of Friction Measurements for Chip Seal.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Lee%2C+Jusang%22">Lee, Jusang</searchLink><relatesTo>1</relatesTo><i> jlee@indot.in.gov</i><br /><searchLink fieldCode="AR" term="%22Lee%2C+Jaejun%22">Lee, Jaejun</searchLink><relatesTo>2</relatesTo><i> yijaejun@kict.re.kr</i><br /><searchLink fieldCode="AR" term="%22Kim%2C+Y%2E+Richard%22">Kim, Y. Richard</searchLink><relatesTo>3</relatesTo><i> kim@ncsu.edu</i><br /><searchLink fieldCode="AR" term="%22Mun%2C+Sungho%22">Mun, Sungho</searchLink><relatesTo>4</relatesTo><i> smun@seoultech.ac.kr</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Testing+%26+Evaluation%22">Journal of Testing & Evaluation</searchLink>. Jul2012, Vol. 40 Issue 4, p603-611. 9p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Microprocessor+testing%22">Microprocessor testing</searchLink><br /><searchLink fieldCode="DE" term="%22Pendulums%22">Pendulums</searchLink><br /><searchLink fieldCode="DE" term="%22Pavements%22">Pavements</searchLink><br /><searchLink fieldCode="DE" term="%22Material+fatigue%22">Material fatigue</searchLink>
– Name: SubjectGeographic
  Label: Geographic Terms
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22North+America%22">North America</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: This paper presents a development in measuring skid resistance in a laboratory performance test for chip seal. It is important to develop a relationship between the British pendulum test (BPT) and the locked-wheel skid test (LWST), or grip tester (GT). The chip seal is a typical pavement preservation treatment used by the North Carolina Dept. of Transportation (NCDOT). In North America, loss of skid resistance is a common road condition that indicates the need for a chip seal, as one of the major advantages of chip seal is an increase in skid resistance. Most agencies have a specified cycle in which skid resistance is measured as a part of their pavement-management system. These skid resistance measurements are invaluable when deciding which roads require chip seal [Gransberg, D. D. and James, D. M. B., "Chip Seal Best Practices," NCHRP Synthesis of Highway Practice 342, Transportation Research Board of the National Academies, Washington, D.C., 2005]. In this study, skid resistance was evaluated on 14 selected chip seals using three different tests: the BPT, LWST, and GT. The correlation between British pendulum number (BPN) and skid number (SN) was relatively strong with an R2 value of 0.74. This finding indicated that the BPN measured in the laboratory could be utilized for predicting the SN, which cannot be measured in the laboratory. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Testing & Evaluation is the property of ASTM International and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=78947935
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1520/jte103863
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 603
    Subjects:
      – SubjectFull: Microprocessor testing
        Type: general
      – SubjectFull: Pendulums
        Type: general
      – SubjectFull: Pavements
        Type: general
      – SubjectFull: Material fatigue
        Type: general
      – SubjectFull: North America
        Type: general
    Titles:
      – TitleFull: A Comparison Study of Friction Measurements for Chip Seal.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Lee, Jusang
      – PersonEntity:
          Name:
            NameFull: Lee, Jaejun
      – PersonEntity:
          Name:
            NameFull: Kim, Y. Richard
      – PersonEntity:
          Name:
            NameFull: Mun, Sungho
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 07
              Text: Jul2012
              Type: published
              Y: 2012
          Identifiers:
            – Type: issn-print
              Value: 00903973
          Numbering:
            – Type: volume
              Value: 40
            – Type: issue
              Value: 4
          Titles:
            – TitleFull: Journal of Testing & Evaluation
              Type: main
ResultId 1