APA (7th ed.) Citation

Chen, C., Tang, Y., Ye, Y. S., Xue, Z., Xue, Y., Xie, X., & Mai, Y. (2014). High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging. Composites Science & Technology, 105, 80. https://doi.org/10.1016/j.compscitech.2014.10.002

Chicago Style (17th ed.) Citation

Chen, Chao, Yongjun Tang, Yun Sheng Ye, Zhigang Xue, Yang Xue, Xiaolin Xie, and Yiu-Wing Mai. "High-performance Epoxy/silica Coated Silver Nanowire Composites as Underfill Material for Electronic Packaging." Composites Science & Technology 105 (2014): 80. https://doi.org/10.1016/j.compscitech.2014.10.002.

MLA (9th ed.) Citation

Chen, Chao, et al. "High-performance Epoxy/silica Coated Silver Nanowire Composites as Underfill Material for Electronic Packaging." Composites Science & Technology, vol. 105, 2014, p. 80, https://doi.org/10.1016/j.compscitech.2014.10.002.