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High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging.

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Title: High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging.
Authors: Chen, Chao1, Tang, Yongjun1, Ye, Yun Sheng1, Xue, Zhigang1 zgxue@mail.hust.edu.cn, Xue, Yang1, Xie, Xiaolin1 xlxie@mail.hust.edu.cn, Mai, Yiu-Wing2
Source: Composites Science & Technology. Dec2014, Vol. 105, p80-85. 6p.
Subjects: Epoxy compounds, Surface coatings, Nanowires, Silver nanoparticles, Composite materials, Electronic packaging, Nanostructured materials, Thermal conductivity
Abstract: Silver nanowires (AgNWs), as one-dimensional nanostructured materials, possess high aspect ratio and intrinsically high thermal conductivity. However, AgNWs are difficult to disperse homogeneously in epoxy resin, and their high electrical conductivity also limits their applications for electronic packaging. Herein, silica-coated silver nanowires (AgNWs@SiO 2 ) were synthesized by a flexible sol–gel method and then incorporated into epoxy. The less stiff silica intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and epoxy, but also enhanced their interfacial interaction. Hence, the thermal conductivity of an epoxy/AgNWs@SiO 2 composite with 4 vol.% filler loading was increased to 1.03 W/mK from 0.19 W/mK of neat epoxy compared to 0.57 W/mK of an epoxy/AgNWs composite with identical nanowire loading. Simultaneously, the insulating silica nanolayer effectively avoided formation of an electrically conductive network of AgNWs in epoxy, leading to high electrical insulation of the composite. AgNWs@SiO 2 nanowires with core–shell structure also improved the dielectric properties of epoxy. In addition, these composites possessed a viscosity suitable for the underfill process in electronic packaging. [ABSTRACT FROM AUTHOR]
Copyright of Composites Science & Technology is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 99636573
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging.
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  Data: <searchLink fieldCode="AR" term="%22Chen%2C+Chao%22">Chen, Chao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Tang%2C+Yongjun%22">Tang, Yongjun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Ye%2C+Yun+Sheng%22">Ye, Yun Sheng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Xue%2C+Zhigang%22">Xue, Zhigang</searchLink><relatesTo>1</relatesTo><i> zgxue@mail.hust.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Xue%2C+Yang%22">Xue, Yang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Xie%2C+Xiaolin%22">Xie, Xiaolin</searchLink><relatesTo>1</relatesTo><i> xlxie@mail.hust.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Mai%2C+Yiu-Wing%22">Mai, Yiu-Wing</searchLink><relatesTo>2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Composites+Science+%26+Technology%22">Composites Science & Technology</searchLink>. Dec2014, Vol. 105, p80-85. 6p.
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  Data: <searchLink fieldCode="DE" term="%22Epoxy+compounds%22">Epoxy compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Surface+coatings%22">Surface coatings</searchLink><br /><searchLink fieldCode="DE" term="%22Nanowires%22">Nanowires</searchLink><br /><searchLink fieldCode="DE" term="%22Silver+nanoparticles%22">Silver nanoparticles</searchLink><br /><searchLink fieldCode="DE" term="%22Composite+materials%22">Composite materials</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Nanostructured+materials%22">Nanostructured materials</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+conductivity%22">Thermal conductivity</searchLink>
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  Label: Abstract
  Group: Ab
  Data: Silver nanowires (AgNWs), as one-dimensional nanostructured materials, possess high aspect ratio and intrinsically high thermal conductivity. However, AgNWs are difficult to disperse homogeneously in epoxy resin, and their high electrical conductivity also limits their applications for electronic packaging. Herein, silica-coated silver nanowires (AgNWs@SiO 2 ) were synthesized by a flexible sol–gel method and then incorporated into epoxy. The less stiff silica intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and epoxy, but also enhanced their interfacial interaction. Hence, the thermal conductivity of an epoxy/AgNWs@SiO 2 composite with 4 vol.% filler loading was increased to 1.03 W/mK from 0.19 W/mK of neat epoxy compared to 0.57 W/mK of an epoxy/AgNWs composite with identical nanowire loading. Simultaneously, the insulating silica nanolayer effectively avoided formation of an electrically conductive network of AgNWs in epoxy, leading to high electrical insulation of the composite. AgNWs@SiO 2 nanowires with core–shell structure also improved the dielectric properties of epoxy. In addition, these composites possessed a viscosity suitable for the underfill process in electronic packaging. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Composites Science & Technology is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.compscitech.2014.10.002
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 6
        StartPage: 80
    Subjects:
      – SubjectFull: Epoxy compounds
        Type: general
      – SubjectFull: Surface coatings
        Type: general
      – SubjectFull: Nanowires
        Type: general
      – SubjectFull: Silver nanoparticles
        Type: general
      – SubjectFull: Composite materials
        Type: general
      – SubjectFull: Electronic packaging
        Type: general
      – SubjectFull: Nanostructured materials
        Type: general
      – SubjectFull: Thermal conductivity
        Type: general
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      – TitleFull: High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging.
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            NameFull: Chen, Chao
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            NameFull: Tang, Yongjun
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            NameFull: Ye, Yun Sheng
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            NameFull: Xue, Zhigang
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              Text: Dec2014
              Type: published
              Y: 2014
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              Value: 02663538
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              Value: 105
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