Screening of variables affecting the selective leaching of valuable metals from waste motherboards' PCBs.
Saved in:
| Title: | Screening of variables affecting the selective leaching of valuable metals from waste motherboards' PCBs. |
|---|---|
| Authors: | Rahimi, Vahid1 (AUTHOR), Inzulza-Moraga, Emilio Antonio1 (AUTHOR), Gómez-Díaz, Diego1 (AUTHOR), Freire, María Sonia1 (AUTHOR), González-Álvarez, Julia1 (AUTHOR) julia.gonzalez@usc.es |
| Source: | Environmental Science & Pollution Research. Oct2025, Vol. 32 Issue 48, p27651-27666. 16p. |
| Subject Terms: | *Leaching, *Motherboards, *Nitric acid, *Nonferrous metals, *Waste recycling, *Thiosulfates, *Thiourea, *Waste products |
| Abstract: | The presence of valuable and hazardous metals in waste printed circuit boards, especially, motherboards, makes their recovery necessary as implies great economic and environmental advantages and develops urban mining processes. Hence, this research is focused on the selective leaching of Cu, Pb, and Sn as base metals using nitric acid and hydrochloric acid and Au, Ag, and Pd as precious metals using thiourea and sodium thiosulfate from waste motherboards' PCBs in a sequential eco-friendly two-stage process. Previously, thiourea and sodium thiosulfate were used as leaching agents to investigate their applicability for the leaching of metals from PCBs in a single-stage process. Screening experimental design was applied to screen the variables affecting the leaching process in order to evaluate their impact on the recovery of metals and select the significant factors. The results demonstrated that base and precious metals can be leached appropriately in two consecutive stages compared to a single-stage process. Nitric acid was found to be a much more efficient agent to leach Cu and Pb in comparison with hydrochloric acid which was more suitable for the leaching of Sn. In the case of precious metals, higher amounts of Au were leached using thiourea, whereas sodium thiosulfate was able to leach more Pd. Roughly similar results were obtained for the leaching of Ag using these leaching agents. Nitric acid concentration, average particle size, temperature, and leaching time were found to be significant to maximize the leaching of Cu and Pb and minimize that for Au, Ag, and Pd in the first stage. Initial pH was the only variable influencing the second stage, in particular, Au leaching by thiourea. [ABSTRACT FROM AUTHOR] |
| Database: | Energy & Power Source |
|
Full text is not displayed to guests.
Login for full access.
|
|
| FullText | Links: – Type: pdflink Text: Availability: 1 |
|---|---|
| Header | DbId: enr DbLabel: Energy & Power Source An: 189934937 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
| IllustrationInfo | |
| Items | – Name: Title Label: Title Group: Ti Data: Screening of variables affecting the selective leaching of valuable metals from waste motherboards' PCBs. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Rahimi%2C+Vahid%22">Rahimi, Vahid</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Inzulza-Moraga%2C+Emilio+Antonio%22">Inzulza-Moraga, Emilio Antonio</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Gómez-Díaz%2C+Diego%22">Gómez-Díaz, Diego</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Freire%2C+María+Sonia%22">Freire, María Sonia</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22González-Álvarez%2C+Julia%22">González-Álvarez, Julia</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> julia.gonzalez@usc.es</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Environmental+Science+%26+Pollution+Research%22">Environmental Science & Pollution Research</searchLink>. Oct2025, Vol. 32 Issue 48, p27651-27666. 16p. – Name: Subject Label: Subject Terms Group: Su Data: *<searchLink fieldCode="DE" term="%22Leaching%22">Leaching</searchLink><br />*<searchLink fieldCode="DE" term="%22Motherboards%22">Motherboards</searchLink><br />*<searchLink fieldCode="DE" term="%22Nitric+acid%22">Nitric acid</searchLink><br />*<searchLink fieldCode="DE" term="%22Nonferrous+metals%22">Nonferrous metals</searchLink><br />*<searchLink fieldCode="DE" term="%22Waste+recycling%22">Waste recycling</searchLink><br />*<searchLink fieldCode="DE" term="%22Thiosulfates%22">Thiosulfates</searchLink><br />*<searchLink fieldCode="DE" term="%22Thiourea%22">Thiourea</searchLink><br />*<searchLink fieldCode="DE" term="%22Waste+products%22">Waste products</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: The presence of valuable and hazardous metals in waste printed circuit boards, especially, motherboards, makes their recovery necessary as implies great economic and environmental advantages and develops urban mining processes. Hence, this research is focused on the selective leaching of Cu, Pb, and Sn as base metals using nitric acid and hydrochloric acid and Au, Ag, and Pd as precious metals using thiourea and sodium thiosulfate from waste motherboards' PCBs in a sequential eco-friendly two-stage process. Previously, thiourea and sodium thiosulfate were used as leaching agents to investigate their applicability for the leaching of metals from PCBs in a single-stage process. Screening experimental design was applied to screen the variables affecting the leaching process in order to evaluate their impact on the recovery of metals and select the significant factors. The results demonstrated that base and precious metals can be leached appropriately in two consecutive stages compared to a single-stage process. Nitric acid was found to be a much more efficient agent to leach Cu and Pb in comparison with hydrochloric acid which was more suitable for the leaching of Sn. In the case of precious metals, higher amounts of Au were leached using thiourea, whereas sodium thiosulfate was able to leach more Pd. Roughly similar results were obtained for the leaching of Ag using these leaching agents. Nitric acid concentration, average particle size, temperature, and leaching time were found to be significant to maximize the leaching of Cu and Pb and minimize that for Au, Ag, and Pd in the first stage. Initial pH was the only variable influencing the second stage, in particular, Au leaching by thiourea. [ABSTRACT FROM AUTHOR] |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=enr&AN=189934937 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11356-024-32793-1 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 16 StartPage: 27651 Subjects: – SubjectFull: Leaching Type: general – SubjectFull: Motherboards Type: general – SubjectFull: Nitric acid Type: general – SubjectFull: Nonferrous metals Type: general – SubjectFull: Waste recycling Type: general – SubjectFull: Thiosulfates Type: general – SubjectFull: Thiourea Type: general – SubjectFull: Waste products Type: general Titles: – TitleFull: Screening of variables affecting the selective leaching of valuable metals from waste motherboards' PCBs. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Rahimi, Vahid – PersonEntity: Name: NameFull: Inzulza-Moraga, Emilio Antonio – PersonEntity: Name: NameFull: Gómez-Díaz, Diego – PersonEntity: Name: NameFull: Freire, María Sonia – PersonEntity: Name: NameFull: González-Álvarez, Julia IsPartOfRelationships: – BibEntity: Dates: – D: 11 M: 10 Text: Oct2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 09441344 Numbering: – Type: volume Value: 32 – Type: issue Value: 48 Titles: – TitleFull: Environmental Science & Pollution Research Type: main |
| ResultId | 1 |
