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Author Correction: Elastic pseudospin transport for integratable topological phononic circuits.

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Title: Author Correction: Elastic pseudospin transport for integratable topological phononic circuits.
Authors: Yu SY; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.; Jiangsu Key Laboratory of Artificial Functional Materials, Nanjing 210093, China., He C; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China., Wang Z; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China., Liu FK; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China., Sun XC; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China., Li Z; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China., Lu HZ; Shenzhen Institute for Quantum Science and Engineering and Department of Physics, South University of Science and Technology of China, Shenzhen 518055, China., Lu MH; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China. luminghui@nju.edu.cn.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China. luminghui@nju.edu.cn.; Jiangsu Key Laboratory of Artificial Functional Materials, Nanjing 210093, China. luminghui@nju.edu.cn., Liu XP; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China. xpliu@nju.edu.cn.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China. xpliu@nju.edu.cn., Chen YF; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China. yfchen@nju.edu.cn.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China. yfchen@nju.edu.cn.
Source: Nature communications [Nat Commun] 2019 Jan 31; Vol. 10 (1), pp. 613. Date of Electronic Publication: 2019 Jan 31.
Publication Type: Journal Article; Published Erratum
Journal Info: Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
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  Data: Author Correction: Elastic pseudospin transport for integratable topological phononic circuits.
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  Data: <searchLink fieldCode="AU" term="%22Yu+SY%22">Yu SY</searchLink>; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.; Jiangsu Key Laboratory of Artificial Functional Materials, Nanjing 210093, China.<br /><searchLink fieldCode="AU" term="%22He+C%22">He C</searchLink>; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.<br /><searchLink fieldCode="AU" term="%22Wang+Z%22">Wang Z</searchLink>; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China.<br /><searchLink fieldCode="AU" term="%22Liu+FK%22">Liu FK</searchLink>; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China.<br /><searchLink fieldCode="AU" term="%22Sun+XC%22">Sun XC</searchLink>; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China.<br /><searchLink fieldCode="AU" term="%22Li+Z%22">Li Z</searchLink>; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China.<br /><searchLink fieldCode="AU" term="%22Lu+HZ%22">Lu HZ</searchLink>; Shenzhen Institute for Quantum Science and Engineering and Department of Physics, South University of Science and Technology of China, Shenzhen 518055, China.<br /><searchLink fieldCode="AU" term="%22Lu+MH%22">Lu MH</searchLink>; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China. luminghui@nju.edu.cn.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China. luminghui@nju.edu.cn.; Jiangsu Key Laboratory of Artificial Functional Materials, Nanjing 210093, China. luminghui@nju.edu.cn.<br /><searchLink fieldCode="AU" term="%22Liu+XP%22">Liu XP</searchLink>; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China. xpliu@nju.edu.cn.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China. xpliu@nju.edu.cn.<br /><searchLink fieldCode="AU" term="%22Chen+YF%22">Chen YF</searchLink>; National Laboratory of Solid State Microstructures & Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, China. yfchen@nju.edu.cn.; Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China. yfchen@nju.edu.cn.
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