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High-speed, scanned laser structuring of multi-layered eco/bioresorbable materials for advanced electronic systems.

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Title: High-speed, scanned laser structuring of multi-layered eco/bioresorbable materials for advanced electronic systems.
Authors: Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Hu Z; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Seo MH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; School of Biomedical Convergence Engineering, College of Information & Biomedical Engineering, Pusan National University, Pusan, 46241, Republic of Korea., Xu Y; The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO, 63130, USA., Yan Y; Department of Neurosurgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., Hsu YH; Department of Chemistry, Duke University, Durham, NC, 27708, USA., Berkovich J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Lee K; Department of Biological Sciences, Northwestern University, Evanston, IL, 60208, USA., Liu TL; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., McDonald S; Department of Chemistry, Duke University, Durham, NC, 27708, USA., Nie H; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Oh H; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA., Wu M; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA., Kim JT; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Miller SA; Laser and Electronics Design Core Facility, Northwestern University, Evanston, IL, 60208, USA., Jia Y; Micro/Nano Fabrication Facility, Northwestern University, Evanston, IL, 60208, USA., Butun S; Micro/Nano Fabrication Facility, Northwestern University, Evanston, IL, 60208, USA., Bai W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, 27599, USA., Guo H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Choi J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Banks A; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Ray WZ; Department of Neurosurgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., Kozorovitskiy Y; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA.; Developmental Therapeutics Core, Northwestern University, Evanston, IL, 60208, USA., Becker ML; Department of Chemistry, Duke University, Durham, NC, 27708, USA.; Department of Biomedical Engineering and Orthopaedic Surgery, Duke University, Durham, NC, 27708, USA., Pet MA; Division of Plastic and Reconstructive Surgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., MacEwan MR; Department of Neurosurgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., Chang JK; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Wearifi Inc., Evanston, IL, 60201, USA., Wang H; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. helingwang1@gmail.com.; Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. helingwang1@gmail.com.; Zhejiang Tsinghua Institute of Flexible Electronics Technology, Jiaxing, 314000, China. helingwang1@gmail.com., Huang Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA. jrogers@northwestern.edu.
Source: Nature communications [Nat Commun] 2022 Oct 31; Vol. 13 (1), pp. 6518. Date of Electronic Publication: 2022 Oct 31.
Publication Type: Journal Article; Research Support, U.S. Gov't, Non-P.H.S.; Research Support, N.I.H., Extramural; Research Support, Non-U.S. Gov't
Journal Info: Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE
Database: MEDLINE Ultimate
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Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. helingwang1@gmail.com.; Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. helingwang1@gmail.com.; Zhejiang Tsinghua Institute of Flexible Electronics Technology, Jiaxing, 314000, China. helingwang1@gmail.com.<br /><searchLink fieldCode="AU" term="%22Huang+Y%22">Huang Y</searchLink>; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu.<br /><searchLink fieldCode="AU" term="%22Rogers+JA%22">Rogers JA</searchLink>; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; 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  Data: <searchLink fieldCode="JN" term="%22101528555%22">Nature communications</searchLink> [Nat Commun] 2022 Oct 31; Vol. 13 (1), pp. 6518. <i>Date of Electronic Publication: </i>2022 Oct 31.
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