Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer.
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| Title: | Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer. |
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| Authors: | Seo H; Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea., Lee GH; Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.; Departments of Cogno-Mechatronics Engineering, Pusan National University, Busan, Republic of Korea.; Departments of Optics and Mechatronics Engineering, Pusan National University, Busan, Republic of Korea., Park J; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea., Kim DY; Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea., Son Y; Program of Brain and Cognitive Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea., Kim S; Graduate School of Semiconductor Technology, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea., Nam KS; Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea., Yang C; Medical Research Center, Seoul National University, Seoul, Republic of Korea., Won J; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea., Bae JY; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea., Kim H; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea., Kang SK; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea., Park S; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.; KAIST Institute for NanoCentury, Daejeon, Republic of Korea., Kang J; Department of Chemistry, Seoul National University, Seoul, Republic of Korea. jiheongkang@snu.ac.kr., Park S; Medical Research Center, Seoul National University, Seoul, Republic of Korea. seongjunpark@snu.ac.kr.; Department of Biomedical Sciences, College of Medicine, Seoul National University, Seoul, Republic of Korea. seongjunpark@snu.ac.kr.; School of Transdisciplinary Innovations, Seoul National University, Seoul, Republic of Korea. seongjunpark@snu.ac.kr.; Interdisciplinary Program in Bioengineering, College of Engineering, Seoul National University, Seoul, Republic of Korea. seongjunpark@snu.ac.kr.; Department of Transdisciplinary Medicine, Seoul National University Hospital, Seoul, South Korea. seongjunpark@snu.ac.kr. |
| Source: | Nature communications [Nat Commun] 2025 May 28; Vol. 16 (1), pp. 4944. Date of Electronic Publication: 2025 May 28. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE; PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
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| Header | DbId: mdl DbLabel: MEDLINE Ultimate An: 40436831 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Seo+H%22">Seo H</searchLink>; Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Lee+GH%22">Lee GH</searchLink>; Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.; Departments of Cogno-Mechatronics Engineering, Pusan National University, Busan, Republic of Korea.; Departments of Optics and Mechatronics Engineering, Pusan National University, Busan, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Park+J%22">Park J</searchLink>; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kim+DY%22">Kim DY</searchLink>; Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Son+Y%22">Son Y</searchLink>; Program of Brain and Cognitive Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea.<br /><searchLink fieldCode="AU" term="%22Kim+S%22">Kim S</searchLink>; Graduate School of Semiconductor Technology, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Nam+KS%22">Nam KS</searchLink>; Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Yang+C%22">Yang C</searchLink>; Medical Research Center, Seoul National University, Seoul, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Won+J%22">Won J</searchLink>; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Bae+JY%22">Bae JY</searchLink>; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kim+H%22">Kim H</searchLink>; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kang+SK%22">Kang SK</searchLink>; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Park+S%22">Park S</searchLink>; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.; KAIST Institute for NanoCentury, Daejeon, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kang+J%22">Kang J</searchLink>; Department of Chemistry, Seoul National University, Seoul, Republic of Korea. jiheongkang@snu.ac.kr.<br /><searchLink fieldCode="AU" term="%22Park+S%22">Park S</searchLink>; Medical Research Center, Seoul National University, Seoul, Republic of Korea. seongjunpark@snu.ac.kr.; Department of Biomedical Sciences, College of Medicine, Seoul National University, Seoul, Republic of Korea. seongjunpark@snu.ac.kr.; School of Transdisciplinary Innovations, Seoul National University, Seoul, Republic of Korea. seongjunpark@snu.ac.kr.; Interdisciplinary Program in Bioengineering, College of Engineering, Seoul National University, Seoul, Republic of Korea. seongjunpark@snu.ac.kr.; Department of Transdisciplinary Medicine, Seoul National University Hospital, Seoul, South Korea. seongjunpark@snu.ac.kr. – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22101528555%22">Nature communications</searchLink> [Nat Commun] 2025 May 28; Vol. 16 (1), pp. 4944. <i>Date of Electronic Publication: </i>2025 May 28. – Name: TypePub Label: Publication Type Group: TypPub Data: Journal Article – Name: TitleSource Label: Journal Info Group: Src Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22Nature+Pub%2E+Group%22">Nature Pub. Group </searchLink><i>Country of Publication: </i>England <i>NLM ID: </i>101528555 <i>Publication Model: </i>Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>2041-1723 (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2220411723%22">20411723 </searchLink><i>NLM ISO Abbreviation: </i>Nat Commun <i>Subsets: </i>MEDLINE; PubMed not MEDLINE |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=mdl&AN=40436831 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1038/s41467-025-60118-4 Languages: – Code: eng Text: English PhysicalDescription: Pagination: StartPage: 4944 Titles: – TitleFull: Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Seo H – PersonEntity: Name: NameFull: Lee GH – PersonEntity: Name: NameFull: Park J – PersonEntity: Name: NameFull: Kim DY – PersonEntity: Name: NameFull: Son Y – PersonEntity: Name: NameFull: Kim S – PersonEntity: Name: NameFull: Nam KS – PersonEntity: Name: NameFull: Yang C – PersonEntity: Name: NameFull: Won J – PersonEntity: Name: NameFull: Bae JY – PersonEntity: Name: NameFull: Kim H – PersonEntity: Name: NameFull: Kang SK – PersonEntity: Name: NameFull: Park S – PersonEntity: Name: NameFull: Kang J – PersonEntity: Name: NameFull: Park S IsPartOfRelationships: – BibEntity: Dates: – D: 28 M: 05 Text: 2025 May 28 Type: published Y: 2025 Identifiers: – Type: issn-electronic Value: 2041-1723 Numbering: – Type: volume Value: 16 – Type: issue Value: 1 Titles: – TitleFull: Nature communications Type: main |
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