| Authors: |
Xiao Y; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics & Xi'an Institute of Biomedical Materials and Engineering, Northwestern Polytechnical University, Xi'an, 710072, China.; Key Laboratory of Flexible Electronics of Zhejiang Province, Ningbo Institute of Northwesterm Polytechnical University, Ningbo, 315103, China., Shen M; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics & Xi'an Institute of Biomedical Materials and Engineering, Northwestern Polytechnical University, Xi'an, 710072, China.; Key Laboratory of Flexible Electronics of Zhejiang Province, Ningbo Institute of Northwesterm Polytechnical University, Ningbo, 315103, China., Chan CY; Department of Materials Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China. chinychan2@cityu.edu.hk.; Department of Chemistry, City University of Hong Kong, Kowloon, Hong Kong SAR, China. chinychan2@cityu.edu.hk., Yu T; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics & Xi'an Institute of Biomedical Materials and Engineering, Northwestern Polytechnical University, Xi'an, 710072, China. iamtyu@nwpu.edu.cn.; Key Laboratory of Flexible Electronics of Zhejiang Province, Ningbo Institute of Northwesterm Polytechnical University, Ningbo, 315103, China. iamtyu@nwpu.edu.cn., Huang W; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics & Xi'an Institute of Biomedical Materials and Engineering, Northwestern Polytechnical University, Xi'an, 710072, China. vc@nwpu.edu.cn.; Key Laboratory of Flexible Electronics & Institute of Advanced Materials Nanjing Tech University, Nanjing, 211816, China. vc@nwpu.edu.cn.; State Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials, Nanjing University of Posts and Telecommunications, Nanjing, 210023, China. vc@nwpu.edu.cn. |
