APA (7th ed.) Citation

YC, S., CP, H., CC, H., SJ, H., MH, S., WH, L., . . . CT, T. (2026). Die shift prediction of fan out panel level packages considering both warpage and flow induced mechanisms with temperature dependent properties. Scientific reports, 16(1), 3994. https://doi.org/10.1038/s41598-025-34076-2

Chicago Style (17th ed.) Citation

YC, Sung, Hu CP, Hung CC, Hwang SJ, Shih MH, Liao WH, Zeng YJ, and Tsai CT. "Die Shift Prediction of Fan Out Panel Level Packages Considering Both Warpage and Flow Induced Mechanisms with Temperature Dependent Properties." Scientific Reports 16, no. 1 (2026): 3994. https://doi.org/10.1038/s41598-025-34076-2.

MLA (9th ed.) Citation

YC, Sung, et al. "Die Shift Prediction of Fan Out Panel Level Packages Considering Both Warpage and Flow Induced Mechanisms with Temperature Dependent Properties." Scientific Reports, vol. 16, no. 1, 2026, p. 3994, https://doi.org/10.1038/s41598-025-34076-2.