Die shift prediction of fan out panel level packages considering both warpage and flow induced mechanisms with temperature dependent properties.
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| Title: | Die shift prediction of fan out panel level packages considering both warpage and flow induced mechanisms with temperature dependent properties. |
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| Authors: | Sung YC; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan., Hu CP; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan., Hung CC; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan., Hwang SJ; Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan. jimppl@mail.ncku.edu.tw., Shih MH; Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan, 710301, Taiwan., Liao WH; Packaging Product Simulation and Design, Innolux Corporation, Tainan, 744092, Taiwan., Zeng YJ; Packaging Product Simulation and Design, Innolux Corporation, Tainan, 744092, Taiwan., Tsai CT; Testing Center, Innolux Corporation, Tainan, 744092, Taiwan. |
| Source: | Scientific reports [Sci Rep] 2026 Jan 03; Vol. 16 (1), pp. 3994. Date of Electronic Publication: 2026 Jan 03. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: Nature Publishing Group Country of Publication: England NLM ID: 101563288 Publication Model: Electronic Cited Medium: Internet ISSN: 2045-2322 (Electronic) Linking ISSN: 20452322 NLM ISO Abbreviation: Sci Rep Subsets: MEDLINE; PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
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