Wang, C., Qi, C., Dozier, A. K., Fernback, J. E., & Kulkarni, P. (2019). Microstructure and Chemical Characterization of Copper Nanoparticles in Wood Dust by TEM/STEM. Microscopy and microanalysis: the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada, 1762. https://doi.org/10.1017/S1431927618009297
Chicago Style (17th ed.) CitationWang, Chen, Chaolong Qi, Alan K. Dozier, Joseph E. Fernback, and Pramod Kulkarni. "Microstructure and Chemical Characterization of Copper Nanoparticles in Wood Dust by TEM/STEM." Microscopy and Microanalysis: The Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada 2019: 1762. https://doi.org/10.1017/S1431927618009297.
MLA (9th ed.) CitationWang, Chen, et al. "Microstructure and Chemical Characterization of Copper Nanoparticles in Wood Dust by TEM/STEM." Microscopy and Microanalysis: The Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada, 2019, p. 1762, https://doi.org/10.1017/S1431927618009297.