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Reflow Soldering Processes

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Title: Reflow Soldering Processes
Description: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.Provides engineers the cutting-edge technology in a rapidly changing fieldOffers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Authors: Ning-Cheng Lee
Resource Type: eBook.
Subjects: Electronic packaging, Electric connectors, Electronic apparatus and appliances--Design and construction, Solder and soldering
Categories: TECHNOLOGY & ENGINEERING / Electronics / General, TECHNOLOGY & ENGINEERING / Industrial Design / Product
Database: eBook Collection (EBSCOhost)
FullText Links:
  – Type: ebook-pdf
Text:
  Availability: 0
Header DbId: nlebk
DbLabel: eBook Collection (EBSCOhost)
An: 195116
RelevancyScore: 979
AccessLevel: 6
PubType: eBook
PubTypeId: ebook
PreciseRelevancyScore: 978.796813964844
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  Data: Reflow Soldering Processes
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  Data: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.Provides engineers the cutting-edge technology in a rapidly changing fieldOffers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
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  Data: <searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+connectors%22">Electric connectors</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+apparatus+and+appliances--Design+and+construction%22">Electronic apparatus and appliances--Design and construction</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+and+soldering%22">Solder and soldering</searchLink>
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RecordInfo BibRecord:
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    Classifications:
      – Code: 621.381046
        Scheme: ddc
        Type: prePub
    Languages:
      – Code: eng
        Text: English
    Subjects:
      – SubjectFull: Electronic packaging
        Type: general
      – SubjectFull: Electric connectors
        Type: general
      – SubjectFull: Electronic apparatus and appliances--Design and construction
        Type: general
      – SubjectFull: Solder and soldering
        Type: general
    Titles:
      – TitleFull: Reflow Soldering Processes
        Type: main
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          Name:
            NameFull: Ning-Cheng Lee
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          Name:
            NameFull: Ning-Cheng Lee
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          Dates:
            – D: 01
              M: 01
              Type: published
              Y: 2002
            – D: 04
              M: 02
              Type: profile
              Y: 2014
          Identifiers:
            – Type: isbn-print
              Value: 9780750672184
            – Type: isbn-electronic
              Value: 9780080492247
          Titles:
            – TitleFull: Reflow Soldering Processes
              Type: main
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