A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications.
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| Title: | A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications. |
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| Authors: | Sauveplane, J.B.1, jean-baptiste.sauveplane@cnes.fr, Retho, P.2, Venet, N.3, Buso, D.1, Perez, G.1, Lefrileux, J.S.2 |
| Source: | Microelectronics Reliability; Aug2015, Vol. 55 Issue 9/10, p1815-1820, 6p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00262714 |
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| DOI: | 10.1016/j.microrel.2015.06.060 |
