Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism.
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| Title: | Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism. |
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| Authors: | Alberti, R.1, Enrici Vaion, R.1, riccardo.enricivaion@st.com, Mervic, A.1, Testa, S.1 |
| Source: | Microelectronics Reliability; Aug2015, Vol. 55 Issue 9/10, p1838-1842, 5p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00262714 |
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| DOI: | 10.1016/j.microrel.2015.06.150 |
