Formation mechanism of pinholes in electroplated Cu films and its mitigation.
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| Title: | Formation mechanism of pinholes in electroplated Cu films and its mitigation. |
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| Authors: | Chen, Chang-Chih1, Hsieh, Cheng-Hui2, Lee, Yu-Wei1, Yang, Cheng-Hsien1, Ho, Cheng-En1, ceho1975@hotmail.com |
| Source: | Thin Solid Films; Dec2015, Vol. 596, p209-215, 7p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00406090 |
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| DOI: | 10.1016/j.tsf.2015.07.063 |
