View in EDS

Formation mechanism of pinholes in electroplated Cu films and its mitigation.

Saved in:
Bibliographic Details
Title: Formation mechanism of pinholes in electroplated Cu films and its mitigation.
Authors: Chen, Chang-Chih1, Hsieh, Cheng-Hui2, Lee, Yu-Wei1, Yang, Cheng-Hsien1, Ho, Cheng-En1, ceho1975@hotmail.com
Source: Thin Solid Films; Dec2015, Vol. 596, p209-215, 7p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 111419347
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Formation mechanism of pinholes in electroplated Cu films and its mitigation.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Chen%2C+Chang-Chih%22">Chen, Chang-Chih</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Hsieh%2C+Cheng-Hui%22">Hsieh, Cheng-Hui</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Lee%2C+Yu-Wei%22">Lee, Yu-Wei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Cheng-Hsien%22">Yang, Cheng-Hsien</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ho%2C+Cheng-En%22">Ho, Cheng-En</searchLink><relatesTo>1</relatesTo>, <i>ceho1975@hotmail.com</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Thin+Solid+Films%22">Thin Solid Films</searchLink>; Dec2015, Vol. 596, p209-215, 7p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=111419347
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.tsf.2015.07.063
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 7
        StartPage: 209
    Titles:
      – TitleFull: Formation mechanism of pinholes in electroplated Cu films and its mitigation.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Chen, Chang-Chih
      – PersonEntity:
          Name:
            NameFull: Hsieh, Cheng-Hui
      – PersonEntity:
          Name:
            NameFull: Lee, Yu-Wei
      – PersonEntity:
          Name:
            NameFull: Yang, Cheng-Hsien
      – PersonEntity:
          Name:
            NameFull: Ho, Cheng-En
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 12
              Text: Dec2015
              Type: published
              Y: 2015
          Identifiers:
            – Type: issn-print
              Value: 00406090
          Numbering:
            – Type: volume
              Value: 596
          Titles:
            – TitleFull: Thin Solid Films
              Type: main
ResultId 1