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Formation mechanism of pinholes in electroplated Cu films and its mitigation.

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Bibliographic Details
Title: Formation mechanism of pinholes in electroplated Cu films and its mitigation.
Authors: Chen, Chang-Chih1, Hsieh, Cheng-Hui2, Lee, Yu-Wei1, Yang, Cheng-Hsien1, Ho, Cheng-En1, ceho1975@hotmail.com
Source: Thin Solid Films; Dec2015, Vol. 596, p209-215, 7p
Database: Applied Science & Technology Source
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