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Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.

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Bibliographic Details
Title:	Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.
Authors:	Fujiwara, Shinichi¹, Harada, Masahide¹, Fujita, Yuji²
Source:	Welding International; Sep2016, Vol. 30 Issue 9, p653-661, 9p
Database:	Applied Science & Technology Source
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Description
ISSN:	09507116
DOI:	10.1080/09507116.2016.1142186