APA (7th ed.) Citation

Fujiwara, S., Harada, M., & Fujita, Y. (2016). Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding. Welding International, 30(9), 653. https://doi.org/10.1080/09507116.2016.1142186

Chicago Style (17th ed.) Citation

Fujiwara, Shinichi, Masahide Harada, and Yuji Fujita. "Interconnection Reliability and Interfacial Structure Between Au Alloy Bump and Al Pad Using Ultrasonic Bonding." Welding International 30, no. 9 (2016): 653. https://doi.org/10.1080/09507116.2016.1142186.

MLA (9th ed.) Citation

Fujiwara, Shinichi, et al. "Interconnection Reliability and Interfacial Structure Between Au Alloy Bump and Al Pad Using Ultrasonic Bonding." Welding International, vol. 30, no. 9, 2016, p. 653, https://doi.org/10.1080/09507116.2016.1142186.