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Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.

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Title: Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.
Authors: Fujiwara, Shinichi1, Harada, Masahide1, Fujita, Yuji2
Source: Welding International; Sep2016, Vol. 30 Issue 9, p653-661, 9p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 116263378
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.
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  Data: <searchLink fieldCode="AU" term="%22Fujiwara%2C+Shinichi%22">Fujiwara, Shinichi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Harada%2C+Masahide%22">Harada, Masahide</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Fujita%2C+Yuji%22">Fujita, Yuji</searchLink><relatesTo>2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Welding+International%22">Welding International</searchLink>; Sep2016, Vol. 30 Issue 9, p653-661, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=116263378
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    Identifiers:
      – Type: doi
        Value: 10.1080/09507116.2016.1142186
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 9
        StartPage: 653
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      – TitleFull: Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.
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            NameFull: Fujiwara, Shinichi
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            NameFull: Harada, Masahide
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            NameFull: Fujita, Yuji
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            – D: 01
              M: 09
              Text: Sep2016
              Type: published
              Y: 2016
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              Value: 30
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              Value: 9
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