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Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.

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Bibliographic Details
Title: Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.
Authors: Fujiwara, Shinichi1, Harada, Masahide1, Fujita, Yuji2
Source: Welding International; Sep2016, Vol. 30 Issue 9, p653-661, 9p
Database: Applied Science & Technology Source
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