Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints.
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| Title: | Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints. |
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| Authors: | Tao, Yeqing1, Ding, Dongyan1, dyding@sjtu.edu.cn, Li, Ting1, Guo, Jason2, Yu, Yunhong2 |
| Source: | Journal of Materials Science: Materials in Electronics; May2016, Vol. 27 Issue 5, p4898-4907, 10p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-016-4373-0 |
