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TEM ANALYSIS OF INTERFACES IN DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS.

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Bibliographic Details
Title: TEM ANALYSIS OF INTERFACES IN DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS.
Authors: Ozaki, T.1, Hasegawa, Y.1, Tsuda, H.2, Mori, S.2, Halbig, M. C.3, Singh, M.4, Asthana, R.5
Source: Ceramic Engineering & Science Proceedings; 2016, Vol. 37 Issue 5, p49-56, 8p
Database: Applied Science & Technology Source
Description
ISSN:01966219