View in EDS PDF Full Text

TEM ANALYSIS OF INTERFACES IN DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS.

Saved in:
Bibliographic Details
Title: TEM ANALYSIS OF INTERFACES IN DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS.
Authors: Ozaki, T.1, Hasegawa, Y.1, Tsuda, H.2, Mori, S.2, Halbig, M. C.3, Singh, M.4, Asthana, R.5
Source: Ceramic Engineering & Science Proceedings; 2016, Vol. 37 Issue 5, p49-56, 8p
Database: Applied Science & Technology Source
FullText Links:
  – Type: pdflink
Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 121489263
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: TEM ANALYSIS OF INTERFACES IN DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Ozaki%2C+T%2E%22">Ozaki, T.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Hasegawa%2C+Y%2E%22">Hasegawa, Y.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Tsuda%2C+H%2E%22">Tsuda, H.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Mori%2C+S%2E%22">Mori, S.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Halbig%2C+M%2E+C%2E%22">Halbig, M. C.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Singh%2C+M%2E%22">Singh, M.</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Asthana%2C+R%2E%22">Asthana, R.</searchLink><relatesTo>5</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Ceramic+Engineering+%26+Science+Proceedings%22">Ceramic Engineering & Science Proceedings</searchLink>; 2016, Vol. 37 Issue 5, p49-56, 8p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=121489263
RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 8
        StartPage: 49
    Titles:
      – TitleFull: TEM ANALYSIS OF INTERFACES IN DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Ozaki, T.
      – PersonEntity:
          Name:
            NameFull: Hasegawa, Y.
      – PersonEntity:
          Name:
            NameFull: Tsuda, H.
      – PersonEntity:
          Name:
            NameFull: Mori, S.
      – PersonEntity:
          Name:
            NameFull: Halbig, M. C.
      – PersonEntity:
          Name:
            NameFull: Singh, M.
      – PersonEntity:
          Name:
            NameFull: Asthana, R.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 06
              Text: 2016
              Type: published
              Y: 2016
          Identifiers:
            – Type: issn-print
              Value: 01966219
          Numbering:
            – Type: volume
              Value: 37
            – Type: issue
              Value: 5
          Titles:
            – TitleFull: Ceramic Engineering & Science Proceedings
              Type: main
ResultId 1