TEM ANALYSIS OF INTERFACES IN DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS.
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| Title: | TEM ANALYSIS OF INTERFACES IN DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS. |
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| Authors: | Ozaki, T.1, Hasegawa, Y.1, Tsuda, H.2, Mori, S.2, Halbig, M. C.3, Singh, M.4, Asthana, R.5 |
| Source: | Ceramic Engineering & Science Proceedings; 2016, Vol. 37 Issue 5, p49-56, 8p |
| Database: | Applied Science & Technology Source |
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