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A review of soft errors and the low α-solder bumping process in 3-D packaging technology.

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Bibliographic Details
Title: A review of soft errors and the low α-solder bumping process in 3-D packaging technology.
Authors: Jung, D. H.1, Sharma, A.1, Jung, J. P.1, jpjung@uos.ac.kr
Source: Journal of Materials Science; Jan2018, Vol. 53 Issue 1, p47-65, 19p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 125686189
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PubType: Academic Journal
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      – Type: doi
        Value: 10.1007/s10853-017-1421-y
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      – Code: eng
        Text: English
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        PageCount: 19
        StartPage: 47
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      – TitleFull: A review of soft errors and the low α-solder bumping process in 3-D packaging technology.
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            NameFull: Jung, D. H.
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              Text: Jan2018
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              Y: 2018
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