Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface.
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| Title: | Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface. |
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| Authors: | Lin, Chao-Ming1, Wu, Chia-Chin1, joechia-chin.wu@mail.ncyu.edu.tw |
| Source: | Microsystem Technologies; Jun2020, Vol. 26 Issue 6, p1835-1845, 11p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09467076 |
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| DOI: | 10.1007/s00542-019-04729-0 |
