APA (7th ed.) Citation

Lin, C., & Wu, C. (2020). Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface. Microsystem Technologies, 26(6), 1835. https://doi.org/10.1007/s00542-019-04729-0

Chicago Style (17th ed.) Citation

Lin, Chao-Ming, and Chia-Chin Wu. "Effects of Bonding Position on Bending Behavior of Flexible Anisotropic Conductive Film Packages Considering Neutral Surface." Microsystem Technologies 26, no. 6 (2020): 1835. https://doi.org/10.1007/s00542-019-04729-0.

MLA (9th ed.) Citation

Lin, Chao-Ming, and Chia-Chin Wu. "Effects of Bonding Position on Bending Behavior of Flexible Anisotropic Conductive Film Packages Considering Neutral Surface." Microsystem Technologies, vol. 26, no. 6, 2020, p. 1835, https://doi.org/10.1007/s00542-019-04729-0.