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Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface.

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Title: Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface.
Authors: Lin, Chao-Ming1, Wu, Chia-Chin1, joechia-chin.wu@mail.ncyu.edu.tw
Source: Microsystem Technologies; Jun2020, Vol. 26 Issue 6, p1835-1845, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 143074091
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface.
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  Data: <searchLink fieldCode="AU" term="%22Lin%2C+Chao-Ming%22">Lin, Chao-Ming</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wu%2C+Chia-Chin%22">Wu, Chia-Chin</searchLink><relatesTo>1</relatesTo>, <i>joechia-chin.wu@mail.ncyu.edu.tw</i>
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  Data: <searchLink fieldCode="JN" term="%22Microsystem+Technologies%22">Microsystem Technologies</searchLink>; Jun2020, Vol. 26 Issue 6, p1835-1845, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=143074091
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s00542-019-04729-0
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 11
        StartPage: 1835
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      – TitleFull: Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface.
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            NameFull: Lin, Chao-Ming
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            NameFull: Wu, Chia-Chin
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            – D: 01
              M: 06
              Text: Jun2020
              Type: published
              Y: 2020
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              Value: 26
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              Value: 6
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            – TitleFull: Microsystem Technologies
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