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Study of temperature dependence of breakdown voltage and AC TDDB reliability for thick insulator film deposited by plasma process.

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Bibliographic Details
Title: Study of temperature dependence of breakdown voltage and AC TDDB reliability for thick insulator film deposited by plasma process.
Authors: Ohguro, T.1, tatsuya.ooguro@toshiba.co.jp, Yagi, Y.1, Kimura, K.1, Kashiura, Y.1, Morioka, J.1, Matsuda, M.1, Yoshida, K.1, Takahashi, M.1, Ishiguro, A.1, Yamada, M.1, Urata, S.1, Tamura, T.1, Fuji, Y.1, Kamakura, T.1, Ohtsuka, K.1, Takano, A.1, Umekawa, S.1
Source: Microelectronics Reliability; Nov2020, Vol. 114, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
Description
ISSN:00262714
DOI:10.1016/j.microrel.2020.113948